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We are an indispensable partner in the optics, equipment engineering, plastics processing and electronics industries. We have also made a name for ourselves as an indirect supplier for the automotive industry. We view the medical engineering industry as a steadily growing market and are working to strengthen our position in this market.
Electronics and Semiconductor Industry
Surface contamination and low surface energy greatly affects bonding, printing and coating processes in the Semiconductor and Electronics manufacturing. Plasmatreat OpenAir® Plasma offers not just reliable surface treatment but also provides efficiency in your process with the possibility of Automation in-line.
Our geographic focus lies in Switzerland. Our other core markets are Germany, Austria and Central and Eastern European countries. Our branch in the Philippines provides us with a central location for our markets in Asia.
Automotive
These potting, casting and encapsulating compounds were formulated to satisfy the requirements of many demanding applications in automotive industries.
Optical
Our Optical Glues are designed for bonding where low strain, optical clarity or low outgassing are required in military, aerospace, fiber optics or commercial optics.
With a broad array of spot and area UV curing systems designed with LED and Lamp UV technology, customers can choose from a wide selection to meet the unique needs of their curing applications.
Medical
We know that in the surgical theatre, there can be no failures. Reliable performance means everything. That’s why our medical products meet ISO 10993 standards. EPO-TEK® medical grade (or biocompatible epoxy adhesives) are used extensively throughout the healthcare and biotech industries.
Mixing / deaerating can be conducted simultaneously within a short time by rotating and revolving (planetary rotating) a container of materials without using a mixing rod / blade or vacuum device
Our Clients
APM Technica provides solution for your specific needs in Adhesive, Adhesive processes and surface modification challenges.